? current range from 24 to 105 amps ? frequency range up to 1mhz ? rohs compliant applications ? multi-phase regulators ? voltage regulator module (vrm) ? desktop and server vrms and evrds ? data networking and storage systems ? notebook regulators ? graphics cards and battery power systems ? point of load modules ? dcr current sensing environmental data ? storage temperature range: -40c to +125c ? operating temperature range: -40c to +125c (with derated current) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape-and-reel packaging, 744 parts per reel, 13? diameter reel description ? halogen free ? 125c maximum total operating temperature ? 7.0 x 15.0 x 5.0mm surface mount package ? ferrite core material ? high current handling capability, low core loss ? designed for high speed, high current switch mode applications ? controlled dcr tolerance for sensing circuits ? inductance range from 100nh to 400nh high current, high frequency, power inductors flat-pac? fp1505 series 0409 bu-sb09350 page 1 of 4 data sheet: 4365 smd device smd device 1 open circuit inductance (ocl) test parameters: 100khz, 1.0v rms , 0.0adc 2 full load inductance (fll) test parameters: 100khz, 1.0v rms ,i sat 1 3i rms : dc current for an approximate temperature rise of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the tempera ture rise. it is recommended that the temperature of the part not exceed 125c under worst case operating conditions verified in the end application. 4i sat 1: peak current for approximately 20% rolloff at +25c. 5i sat 2: peak current for approximately 20% rolloff at +125c. 6 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i * 10 -3 .b p-p :(gauss), k: (k-factor from table), l: (inductance in nh), i (peak-to-peak ripple current in amps). 7 part number definition: fp1505rx-rxx-r ? fp1505 = product code and size ? rx= dcr indicator ? rxx= inductance value in uh, r = decimal point ? -r suffix = rohs compliant product specifications part ocl 1 fll 2 i rms 3 i sat 1 4 i sat 2 5 dcr (m ) number 7 10% ( n h) min. (nh) (amps) (amps) @25c (amps) @125c @20c k-factor 6 FP1505R1-R10-R 100 72 105 90 356.3 fp1505r1-r12-r 120 86 87 75 356.3 fp1505r1-r15-r 150 108 53 72 60 0.47 7% 356.3 fp1505r1-r25-r 250 180 42 32 356.3 fp1505r1-r30-r 300 217 35 26 356.3 fp1505r1-r40-r 400 288 24 19.5 356.3 halogen hf free
2 schematic 1 15 4.50 (2x) 2.50 (2x) 6.7 0.3 1.9 ref. (2x) front view 2.8 ref. 5.00 max 14.7 0.3 1 2 recommended pad layout side view top view 1505rx rxx wwllyy r 2.0 ref a b dimensions - mm user direction of feed s ection a -a a a 5.4 1.5 dia 1.5 dia 4.0 2.0 16.0 1.75 11.5 24.0 0.3 15.4 7.4 1505rx rxx wwllyy r 0 5 10 15 20 25 30 35 40 45 50 00.40.81.21.62 total loss (w) temperature rise (c) part marking: coiltronics logo 1505rx rx = dcr indicator rxx = inductance value in h. (r = decimal point). wwllyy = date code r = revision level supplied in tape-and-reel packaging, 744 parts per reel, 13? diameter reel. packaging information - mm temperature rise vs.total loss 0409 bu-sb09350 page 2 of 4 data sheet: 4365 the nominal dcr is measured between points ?a? and ?b?
0409 bu-sb09350 page 3 of 4 data sheet: 4365 core loss vs. b 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 b (g a u s s ) core loss (w) 1 mhz 500 khz 300 khz 200 khz 100 khz p-p p-p % of ocl vs. % of i sat 1 0% 20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% 140% % of i sa t 1 % of ocl +125c +25c -40c inductance characteristics core loss
? 2009 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com 0409 bu-sb09350 page 4 of 4 data sheet: 4365 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. al l other copies of this document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the company. life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me packa g emm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me packa g emm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tan d ar d s np b s ol d er lea d (p b ) free s ol d er pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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